| PART |
Description |
Maker |
| SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
|
Infineon
|
| SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
| SB120-1.1 SB1100-1.1 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| SB140-1.3 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| SB540-2.0 SB520-2.0 SB5100-2.0 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| SIDC30D120H6 |
Diodes - HV Chips - SIDC30D120H6, 1200V, 50A
|
Infineon
|
| SIDC110D170H |
Diodes - HV Chips - SIDC110D170H, 1700V, 200A
|
Infineon
|
| SIDC81D60E6 |
Diodes - HV Chips - SIDC81D60E6, 600V, 200A
|
Infineon
|
| SIDC14D120F6 |
Diodes - HV Chips - SIDC14D120F6,1200V, 15A
|
Infineon
|
| SIDC14D120E6 |
Diodes - HV Chips - SIDC14D120E6, 1200V, 15A
|
Infineon
|
| SIDC46D170H |
Diodes - HV Chips - SIDC46D170H, 1700V, 75A
Fast switching diode chip in EMCON 3 -Technology
|
INFINEON[Infineon Technologies AG]
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
